在无铅化电子组装时代带来之际，本公司向您推荐波峰用Sn-0.7Cu无铅锡条。本产品生产口独家精炼和抗氧化技术，严格控制铅含量在100ppm以下，从而帮助您顺利渡到无铅化制程。
As the lead-free eletronics assembly times is coming,we strongly recommend using Sn-0.7Cu lead-free wave solder.This product has exclusive refining and antioxidant technology.Strict control of lead content below 100ppm,which helps you smoothly transition to lead-free manufacturing process.
高抗氧化锡条High Antioxidant Tin Bar
在300℃以下的焊接温度，液态焊料表面镜面光亮，润湿时间短，扩展率。由于抗氧化剂的加入使焊接点光亮，润色美观，适用于PCB的波峰焊和热浸焊。配有多种合金比例提供客户选择。
The welding temperature below 300℃,the liquid solder surface bright as the mirror surface,wetting time is short,the expansion rate.As the add of antioxidant,the welding point become bright and beautiful.Applicable to PCB‘s wave soldering and hot dip.With a variety of alloy proportion for customers to choose from.
高温锡条High temperature Tin Bar
在450℃的高温条件下，焊料表面长期保持白色的镜面状态，出渣仅为普通焊锡条的1/7左右，适用于波峰焊和热浸焊工艺。特别适用于各种变压器制造时自溶漆包线的搪锡。低渣量的效果，不但减少了不良焊点，节约成本开支，同时减少了锡炉维修机会。配有多种合金比例供客户选择。
In the high temperature of 450℃,solder suiface can keep a white mirror state for a long time,slag is only about 1/7 of the ordinary solder,used for wave soldering and hot dip process.Especially suitable for the enameling tin of autolysis paint covered wire when producing various transformer.The effect of the low amount of slag ,not only reduced the bad solder joints,saving costs and expenses,and also reduce the chance of tin stove maintenance.With a variety of alloy ratio for the customer to choose from.
Sn-Ag-Cu,Sn-Cu系列（浸焊/波焊首选合金）
优点：
耐热疲劳性，蠕变抗力优
剪切强度，耐久性（ceep）优
熔融温度区域狭小
含铅电镀之恶性影响少
供应形状不受限制（棒，线，膏，块状等）
与现有元件基板创线在金属性能相容
抑制炉内之金属间化合物的生成（AIM）
在线交谈